3. Graduate Courses
There are 27 graduate courses and 24 courses were offered in year 2007. The contents of courses are introduced below:
Progress in Semiconductor Device Physics (71020013)
Instructor: Xu Jun
Crystal symmetry analysis and complex band structure, carrier scattering theory and field density, hot carrier transportation; short-channel MOS device physics; Heterojunction device and physics; Photoelectric effects and luminescence of semiconductors; Noncrystal semiconductor and device.
Digital VLSI Circuits (71020023)
Instructor: Zhou Runde
The course provides theoretical analysis to VLSI fundamental issues in more depth and introduces recent achievements of digital MOS VLSI, including a study of small dimension VLSI principles, structures and design methods of various digital MOS VLSI circuits, delay and timing problems in VLSI and different clocking techniques. An introduction to VLSI parallel algorithm and VLSI system architecture is also provided in the course.
Analog LSI Circuits (71020033)
Instructors: Wang Zhihua and Li Fule
Overview of Analog Integrated Circuits, Modern MOS Operational Amplifier; Advanced Bipolar Operational Amplifier, Special Operational Amplifier, Integrated Voltage Regulators, Nonlinear Analog Integrated Circuits, Switched Capacitor and Switched-current Filters; High Performance Continuous Time Filter, Advanced DAC and ADC; Future in Analog Design, Analog Circuit Computer Aided Design.
High-level Synthesis of Digital VLSI Systems (71020043)
Professor Wei Shaojun
Introduction to design methods on each design level during top-down procedure (including VHDL, design flow, behavioral description and simulation, the mapping between behavioral description and object architecture, datapath testing controller design, test pattern generation, system verification); behavioral design, datapath design and controller design and their optimizations, including VHDL description, operation scheduling, resource allocation, register assignment, control code generation, controller architectures and state optimization.
IC-CAD (71020053)
Instructor: Yu ZhiPing
The implementation of RF circuits using silicon CMOS technology. High (RF) frequency characterization and modeling of deep sub-micron (DSM) devices. The analysis and design of circuit modules, Such as LNA, VCO, PLL, frequency synthesizer, power amplifier (PA), and etc., for RF transceivers. Substrate coupling and related issues and solution approaches for the design mixed digital, analog, and RF circuits.
IC Manufacture Processing and Equipment (71020062)
Instructor: Wang Shuidi
Brief introduction to IC circuit Silicon development, emphasize on individual processing techniques, using processing flow of a dual-well CMOS as an example to introduce applications of those individual processing techniques. Packaging techniques are introduced especially for new technologies. IC processing techniques applied in MEMS are also introduced, as well as IC manufacture equipments and cleaning techniques.
Analysis and Design of CMOS RF Integrated Circuits (71020073)
Instructor: Yu ZhiPing
Introduce the implementation of RF circuits using silicon CMOS technology and high frequency characterization and modeling of deep sub-micron (DSM) devices. The analysis and design of circuit modules, Such as LNA, VCO, PLL, frequency synthesizer, power amplifier (PA), and etc., for RF transceivers. Substrate coupling and related issues and solution approaches for the design mixed digital, analog, and RF circuits.
VLSI Networks (81020012)
Instructors: Chen Zhilian
The recent development trend and research emphases of VLSI Networks are introduced in this course which mainly consists of three parts. The basic principles and design methods are stressed. Switched-capacitor Networks (SCN): Fundamentals of sampled data system, analyses in Z domain and frequency domain, basic building blocks, synthesis and design methods of SC filters, non-filtering applications of SCN. Continuous Time Networks (CTN): Fundamental principles and design methods of new type of MOSFET-C and Gm-C filters. Artificial Neural Networks and Fuzzy Logic (ANN & FL): Neuron and its model, basic principles of network, VLSI implementation of neural network, fuzzy set and membership function, fuzzy pattern recognition.
IC Design Practice (80260012)
Instructors: Li Fule
Full-Customer IC design practise. A complete design procedure implemented from architecture consideration, floorplan, circuit design and skills, layout design and verification, whole chip analysis toward tapeout, all the way to packaged chip testing.
Cryptography and network security( 80260023)
Instructors: Bai Guoqiang
Introduce traditional encrypt techniques, encryption algorithms, current symmetric encrypt techniques (DES, AES, RC4), encrypt function setup and password management, message authentication and Hash algorithm, digital signature and Authentication Protocol, as well as protocles of network security.
Digital Integrated System Design ( 70260013)
Instructor:Zhang Chun
Introduction of HDL Language, design method of digital integrated system, high level synthesis technology, principle an design technology of programmable logic device. Final project of VGA controller and serial communication are implemented on FPGA to let students practice themselves.
New micro/nanoelectronic material and devices(80260032)
Instructor:Ren tianling
This course will introduce basic concepts of new micro/nanoelectronic materials and devices. Main topics include: new dielectric material and integrated devices, magnetoelectric material and devices, low dimensional semiconductor material and devices, molecular electronics etc.
PLL Design and Clock/Frequency Generation (80260042)
Instructor:Li Yugeng
Brief course introduction£ºThis course gives insights into phase-locked clock generation and helps students to gain system perspectives and circuit design aspects of the phase-locked loop (PLL) for wireless and wireline communications. In the first half of the course, basic theoretical analyses of the PLL and system/circuit design issues will be discussed. The second half of the course consists of extensive materials covering various PLL applications and more advanced topics; frequency synthesis, clock-and-data recovery, delay-locked loops, on-chip testability and compensation, coupling in SoC design, and future challenges. Advanced topics such as coupling, testability, and on-chip compensation will be also useful for those who are interested in system-on-chip (SoC) design and advanced mixed-signal IC design.
Semiconductor Memory Technologies (80260052)
Instructor:Pan Liyang
The purpose of this course is to provide students with knowledge of the mainstream semiconductor memory technologies, including basic concepts, memory devices, memory circuitries, process technologies and novel memories. The course also aims to help the students understand the memory design methodologies and improve the systemic application ability of the basic knowledge.
Microprocessor Architecture and Design (81020022)
Instructors: Li Shuguo and Qi Jiayue
Microprocessor developing history; Microcomputer and microprocessor performance evaluation; Instruction set level architecture and RISC technique; Data path and control unit design; Pipeline technique; Memory management and cache design; Developing trend of microprocessor.
Introduction to VLSI Testing Methodology (81020032)
Instructors: Sun Yihe
VLSI logic model and logic simulation; VLSI fault model and fault simulation; VLSI testing generation method and automatic testing pattern generation; Intelligent VLSI microprocessor & digital signal processor testing method and testing pattern generation method; The testing methodology for mix signal circuit; VLSI design of testability (full scan Z partial scan, non-scan, boundary scan etc.); the fault model and automatic testing pattern generation for system level VLSI; the configuration and architecture of integrated CAT system, the requirement and implementation of the environment testing.
Microelectronic Packaging Technology (81020042)
Instructors: Cai jian
The main contents of ¡°Microelectronic Packaging Technology¡± course is about the function and developing trend of microelectronic packaging, main package types now used for IC, the design considerations for microelectronic package in mechanism, electric, thermal, thermo-mechanical and other performances, basic manufacture processes and major materials of plastic and ceramic packages for IC, main selection principles for IC package, dominant fault models and test methods of IC package, harm and protection of ESD, and the models for ESD sensitivity testing.
Physics of Micro/ Nano Fabrication (81020052)
Instructors: Liu Zewen
Physic principle of Micro/Nano device and structure fabrication techniques, including formation of photon, ion, electron, X-ray beam and their interaction with matters. Principle of lithographic, film technology wet and dries etching process.
MEMS ( Micro electromechanical system) (81020062)
Instructors: Liu Litian
MEMS principal and its structure, design method and fabrication technology. Introduction of some typical MEMS devices, micro integrated sensors, acting devices and micro system. Application of MEMS in information, biology, medical, space industry etc.
VLSI DSP (Digital Signal Processing) (81020082)
Instructors: Chen Hongyi, Liu Leibo
Introduce of DSP, basic hardware, frame and type of DSP. Design method and some practical samples of VLSI DSP.
IC Manufacture and Processing Management
Instructors: Xiang Cailan and Zhang Zhigang
Operating management, technical management of IC manufacture, manafacture of IC processing flow, learning curves, typical application of linear planning in operating management, practical IC manufacture planning system, QA management, SPC, study of processing ability, management of supply chain, storage system of independent requests, IC-CAM system introduction, IC virtural manufacture.
Advanced Topics in Microelectronics (91020012)
Instructors: Li Zhijian, Liu Litian, Qi Jiayue, Chen Hongyi and Shi Bingxue
Silicon system on chip technology, Deep submicron VLSI engineering; MicroelectroMechanical systems characteristic, principle, structure, fabrication technology and typical MEMS devices; (MEMS) characterization, modeling and simulation of interconnect line for deep submicron technology, Experimental technique and device simulations for investigating the substrate crosstalk in mixed-mode circuits; Floor planning in deep submicron integrated circuits design; Properties of digital signal processing; Linear Prediction Coding (LPC) speech synthesizer, Artificial neural network; fuzzy logic and fuzzy processor; Character recognition and speech recognition, VLSI for Hamming neural network and fuzzy recognizer, Smart IC Card architecture, operation system, security technique.
Integrated Ferroelectrics (81020092)
Instructor: Ren Tian-Ling
There are two main parts in the course. One is about the fundamental theory and method of integrated ferroelectrics, including the structure and fundamental properties of ferroelectrics, preparation processes, device integration issue, testing, etc. The second part is about the application of integrated ferroelectrics, including ferroelectric memory devices, MEMS devices, high frequency devices, infrared devices, etc.4.dissertations
Nanoelectronic Devices (81020112)
Instructor: Wang Yan
Introduction to nanoelectronics device; theory and application of single-eletron device; theory and application of resonant tunneling diode; quantum interference devices; spinelectronics devices; structure and application of carbon nanotube; nano-manufacture.
CMOS Integrated Circuit Manufacturing Experiment (81020122)
Instructor: Liu Zhihong
This course is to provide an opportunity for the students to practice the theoretical knowledge on semiconductor device and integrated circuit manufacturing. CMOS integrated circuit samples will be fabricated independently by the students in the industrial ULSI process pilot line. The student capability of independent experiment and failure analysis on the integrated circuit manufacturing will be trained.
4. Doctor Dissertations in 2007
• (1) Zhang Yanjun, Supervisor: Sun Yihe
Studies on the design methodology of application oriented instruction set prosessor
• (2) Liu Xingming£¬Supervisor: Liu Litian
Study on novel structure uncooled infrared detector
• (3) Ye Zuochang, Supervisor: Yu Zhiping
Study on Green function extract for the passive devices in RF-CMOS circuits
• (4) Ning Yanqing, Supervisor: Chen Hongyi
Research on the key techniques in broad band CMOS LC VCO
• (5) Jia Ze, Supervisor: Liu Litian
Research on design and fabrication of ferro-electronic memory
• (6)Wu Jiangang, Supervisor: Liu Litian
Research on the micro fluidic chips
• (7) Wang Weizhi, Supervisor: Jin Dongming
VLSI realization of the neuro-fuzzy system
• (8) Sun Lei, Supervisor: Zhu Jun
Study on the key technologies in the non-volatile charge capture memory
• (9) Zhu Yiping, Supervisor: Li Zhijian
Sdudy on the silicon based ferro-electro acoustic devices
• (10)Ma Liwei, Supervisor: Sun Yihe
On-line methodology for ASIC design
• (11)Zhang Xun, Supervisor: Jin Dongming
Smart sensor and related CMOS circuit
5. Class for advanced studies of graduate student's course
Third Graduate Program has been started for advanced studies at Beijing IC Design Park. Number of students is 30.
6. Awards Granted to Graduate Students
4 students obtained excellent MS thesis award of Tsinghua University, listed as following:
• Bai Rongrong Supervisor: Li Yongming
¡ªDesign and realization of low power passive UHF RF-tag
• Liu Peng, Supervisor: Liu Litian
¡ªStudy on spin valves based linear GMR sensor
• Kang Ming, Supervisor: Yue Ruifeng
¡ªStudy on liquid variable focus lens based on electrowetting-on-dielectric
• Han Yongxiang, Spervisor: Bai Guoqiang
¡ªVLSI design of the coprocessor for elliptic curve cryptosytem over binary fields
